DOBBERTIN Industrie-Elektronik

Fassungen - Sockel

Auswahl

SOJ
Small Outline J-Lead
20 - 36 Pin

Dead Bug Insertion

IC100


SOJ
Small Outline J-Lead
20 - 44 Pin

Live Bug Insertion

IC107


SOP, SSOP, TSOP Type I and II
8 - 72 Pin

IC 51


SOP, SSOP, TSOP Type I and II
16 - 88 Pin

IC 189

 


TSOP, Type I
Thin Small Outline Package
32 - 56 Pin

IC191

 


 

SOP, SSOP, TSOP Type II
8 - 54 Pin

IC 235


TSOP Type II
Thin Small Outlint Package
50 - 66 Pin

IC363

 



TSOP Type II
Thin Small Outlint Package
54 Pin

IC369



QFP, PQFP, TQFP
32 - 304 Pin

IC51






Shrinked Quad Flat Package
2-point Contact Type
100 - 144 Pin

IC402



 


Open Top - Quad Flat Package
44 - 304 Pin

IC200 - IC248



 


Quad Flat Package
QFP - Shoulder Contact Type
32 - 256 Pin

IC234


  BQFP
Bumper Quad Flat Package
100 - 196 Pin

IC51-100

Clamshell

 


BQFP
Bumper Quad Flat Package
84 - 164 Pin

IC211

 


PLCC
Plastik Lead Chip Carrier
20 - 124 Pin

IC51

 


PLCC
Plastic Lead Chip Carrier
18 - 84 Pin

IC120

 


LCC
Leadless Chip Carrier
44-68 Pin

IC53 / IC51

 



TCP / TAB
Tape Carrier Package / Tape Automated Bonding

 


PGA / ZIF
Pin Grid Array
Zero Insertion Force
121 - 625 Pin

NP89


  PGA / ZIF
Pin Grid Array
Zero Insertion Force
196 - 289 Pin

NP161


     PGA / ZIF
Pin Grid Array
Zero Insertion Force
640 - 720 Pin

NP178


PGA / ZIF
Pin Grid Array
Zero Insertion Force
1020 Pin

NP236

 


BGA
Socket with Carrier
SMT
256 - 1225 Pin

YED514

 


BGA, 1,50mm Pitch
Ball Grid Array

IC264

 


BGA, 1,27mm Pitch
Ball Grid Array
89 - 1105 Pin

NP276

 


Shrink BGA, 1,27mm Pitch
Shrink Ball Grid Array

NP396

 


FBGA, 1,00mm Pitch
Fine Ball Grid Array
48 - 2116 Pin

NP352


FBGA, 0,8mm Pitch
Fine Ball Grid Array
48 - 532 Pin

NP351


FBGA / CSP / LGA
169 - 868 Pin

IC280


FBGA, 0,75mm Pitch
Fine Ball Grid Array
36 - 288 Pin

NP291


CSP, 0,5mm Pitch
Chip Scale Package - TH

NP284


CSP, 0,5mm Pitch
Chip Scale Package

NP383


CSP, 0,5mm Pitch
Chip Scale Package
SMT

IC398