| |
|
| Features |
|
|
|
- Pitch
sizes 0.5, 0.65, 0.8 and 1.0mm
|
- Open
top type sockets for QFP packages
|
- Lever
operation ensures low actuation force and high durability
|
- Unique
contact design ensures outstanding contact reliability and
increased density on burn-in boards
|
| |
|
| Specifications |
|
| Insulation
Resistance: |
1,000M min. at 500V DC
or
1,000M min. at 100V
DC |
| Dielec. Withstd.
Voltage: |
100V AC for 1
minute or
500V AC for 1 minute or
700V AC for 1
minute |
| Contact
Resistance: |
30m max. at
10mA/20mV max. |
| Operating Temp.
Range: |
–40°C to
+170°C |
| Contact
Force: |
20g min. per pin at
min.
displacement of 0.3mm
80g max. per
pin at max.
displacement of 0.7mm |
|
|
| Materials and Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS),
glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel |
