|
|
| Series: IC234 - Open Top |
| Title: Quad Flat Package
(QFP) |
| |
|
| Features |
|
|
|
- Pitch
sizes 0.4, 0.5, 0.65 and 0.8mm
|
- Open
top sockets for QFP packages using a shoulder contact
system
|
- Universal socket for both long and short IC
leads
|
- Contact
system protects the IC lead from wear and tear during
testing
|
| |
|
| Specifications |
|
| Insulation
Resistance: |
1,000M min. at 100V DC, pitch
0.4, 0.5
1,000M min. at 500V DC, pitch 0.65, 0.8 |
| Dielec. Withstd.
Voltage: |
for 1 minute at
100V AC, pitch 0.4, 0.5
for 1 minute at
500V AC, pitch 0.65
for 1 minute at
700V AC, pitch 0.8 |
| Contact
Resistance: |
30m max. at 10mA/20mV
max. |
| Operating Temp.
Range: |
–40°C to
+150°C |
| Contact
Force: |
20g to 80g per
pin |
| Mating
Cycles: |
10,000 insertions
min.
5,000 insertions min.,
(IC234-1004-009) |
|
|
| Materials and Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
