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Click on
Data Sheet for further information about:
-Part Number
Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet
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| PDF file size:
93KB | |
| Series: IC51 - Clamshell |
| Title: Bumper Quad Flat Package
(BQFP) |
| |
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| Features |
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- Pin counts 100, 132,
164 and 196
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|
- Clamshell socket for
BQFP devices
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| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
700C AC for 1minute |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–55°C to +170°C |
| Mating
Cycles: |
25,000 insertions min. |
| Contact Force: |
50g min. per pin at min.
displacement of
0.3mm
150g max. per pin at max.
displacement of 0.7mm |
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|
| Materials and Finish |
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| Housing: |
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium
Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
