|
Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout |
(PDF file size:
58KB)
. | |
| Series: IC402 - Shrinked Open Top with 2-point
Contact |
| Title: Quad Flat Package
(QFP) |
| |
|
| Features |
|
- Shrinked socket dimensions for QFP Package
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| Specifications |
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| Insulation
Resistance: |
1,000M min. at 100V DC,
0.4,
0.5 pitch
1,000M min. at 500V DC,
0.65, 0.8 |
| Dielec. Withstd.
Voltage: |
100V AC for 1
minute.
0.4, 0.5 pitch
500V AC
for 1 minute,
0.65 pitch |
| Contact
Resistance: |
30m max. at 10mA/20mV
max. |
| Operating Temp.
Range: |
–40°C to
+170°C |
| Contact
Force: |
45g min. to 20g per
pin |
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|
| Materials and
Finish |
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| Housing: |
Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS),
glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel | | |
