|
Click on Data
Sheet for further information about:
-Part Number
Details -Socket Dimensions -IC Dimenstions
-PCB
Layouts
See Table Below
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Series: NP351 - Open Top
(ZIF) |
Title: Fine Ball Grid Array
(FBGA) |
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Features |
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- Pin counts from
48 to 520
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- Open top type
sockets for FBGA packages
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- Self contacting
structure without upper pressing force
(ZIF)
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- Contacting
structure to nip the sides of solder balls
to
lower damages of coplanarity of solder
balls
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Specifications |
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Insulation Resistance: |
1,000M min. at 100V DC |
Dielec. Withstd. Voltage: |
100V AC for 1 minute |
Contact Resistance: |
100m max. at 10mA/20mV
max. |
Operating Temp. Range: |
–55°C to +150°C |
Contact force: |
15g per pin approx. |
Mating
Cycles: |
10,000
insertions |
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Materials and
Finish |
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Housing: |
Polyetherimide (PEI), glass-filled Polyetherssulphone
(PES), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold
over
Nickel | | |