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Click on Data
Sheet for further information about:
-Part Number
Details -Socket Dimensions -IC Dimensions
-PCB
Layouts
See Table Below
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Series: NP276 - Zero Insertion Force
(Open Top) |
Title: Ball Grid Array
(BGA) |
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Features |
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- Any amount of
pin counts are possible
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- Open top type
sockets for BGA packages
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- Self contacting
structure without upper pressing force (ZIF)
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- Changes to the
IC ball flatness are minimized by contacting the ball
from the side to protect it from damage
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
100V AC for 1 minute |
Contact Resistance: |
30m max. at 10mA/20mV max. |
Operating Temp. Range: |
–55°C to +150°C –40°C to +170°C max.
for NP276-11904-x |
Contact force: |
30g per pin approx. |
Mating
Cycles: |
10,000
insertions |
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Materials and
Finish |
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Housing: |
Polyetherimide (PEI), glass-filled Polyetherssulphone
(PES), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold
over
Nickel | | |