AP3 BGA63-1.13 CS NAND-1
Order No.: 73-4250

specialized programming module for NAND flash devices in BGA63 package 11x9x max 1.2mm, pitch 0.8mm, grid 12x10
used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 500.000 actuations
supported from PG4UW software version 3.31

Ord. no. 73-4250
Socket ZIF BGA63, ClamShell type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass Memory (NOR/NAND/eMMC)

Order no.: 73-4250
Price:        € 449,00

Module manual

  • Protect the contacts of module's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module's ZIF socket may lead to programmed device damage.
  • Unscrew knurled thumb screw. Properly Insert programming module into Programmer Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programmer Module Interface connectors is possible. Screw knurled thumb screws to fix programming module to programmer.
  • Release the pawl on module's ZIF socket to open it. The socket cap will open by spring force. Insert the device into module's ZIF socket. The correct position of the programmed device is shown on PCB of the module. The reference corner (position of pin A1) of the device is indicated by dot.
  • Visually check the placement of programmed device in module's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from module, push the cover of module's ZIF socket and remove the device.
  • When you finish the work with module, unscrew knurled thumb screw and remove the module from Programmer Module Interface connectors.
  • For handling with the device we recommended to use a vacuum pick up tool.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Accepted package(s)

BGA package


NAME

 SYMBOL MIN NOM MAX

Profile

 A 0.8 0.9 1

Ball Height

 A1 0.27 0.32 0.37

Body Thickness

 A2 - - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -


NAME

 SYMBOL MIN NOM MAX

Profile

 A 0.8 0.9 1

Ball Height

 A1 0.25 0.3 0.35

Body Thickness

 A2 0.55 0.6 0.65

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 12 -


NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1.2

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 0.3 0.4

Body Thickness

 A2 0.55 - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1.05

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - - 0.7

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1.05

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - 0.65 -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 - 0.35

Body Thickness

 A2 - 0.6 -

Ball Diameter

 b 0.4 - 0.5

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 - -

Body Thickness

 A2 0.6 0.65 0.7

Ball Diameter

 b - 0.45 -

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 10 -

Ball Array E

 GE - 8 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - - -

Ball Diameter

 b - 0.45 -

Body Size

 D 10.9 11 11.1

Body Size

 E 8.9 9 9.1

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.22 0.26 0.3

Body Thickness

 A2 - - -

Ball Diameter

 b 0.41 0.46 0.51

Body Size

 D - 11 -

Body Size

 E - 9 -

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A 0.8 0.9 1

Ball Height

 A1 0.25 0.3 0.35

Body Thickness

 A2 0.59 - 0.74

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D - 11 -

Body Size

 E - 9 -

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1

Ball Height

 A1 0.25 - -

Body Thickness

 A2 - - -

Ball Diameter

 b 0.4 0.45 0.5

Body Size

 D - 11 -

Body Size

 E - 9 -

Ball Pitch

 e - 0.8 -

Ball Array D

 GD - 12 -

Ball Array E

 GE - 10 -
   

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The information in this document are subject to change without notice.