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DIL24/BGA24-2 ZIF HFlash-1
Order No.: 70-4498
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specialized adapter for Spansion/Cypress Hyper Bus Flash S26KLxxx devices in
BGA24 package
used ZIF socket accepts many variants of
supported package, different in ball diameter, ball high and/or body
thickness, see section Accepted package(s) board
operation (mechanical) life of ZIF socket -
50.000 actuations
supported from PG4UW software version 3.36c
| Ord. no. |
70-4498 |
| Socket |
ZIF BGA24, open top type |
| Bottom |
2 rows, 2x24 pins, square, 0.6x0.6mm,
rows spacing 600mil |
| Class |
Specialized |
| Subclass |
Memory (NOR/NAND/eMMC) |
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Order no.: 70-4498
Price: €
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Converter manual
- Protect the pins of adapter and adapter's ZIF
socket from contamination. Don't touch the pins with
bare hands. Any dirt and/or fat may cause errors
during programming.
- Usage of
vacuum pick up
tool is expected for device handling.
- Proceed with care! Incorrect insertion of
adapter in programmer's ZIF socket or device in
adapter's ZIF socket may lead to programmed device
damage.
- Insert adapter into
programmer's ZIF socket. If you are in doubts about
orientation of the adapter in programmer's ZIF
socket, there is a rule of thumb - orientation of
adapter's name text is the same as orientation of
the text on the top of programmer.
- Visually check the placement
of adapter in programmer's ZIF socket.
- Push the cover of adapter's
ZIF socket (the topmost movable part) to open the
socket. Once fully actuated, drop the device into
the socket from a height of 2 to 3mm above the
seating plane. For correct device orientation,
follow the instructions shown on picture in PG4UW
software Device info window for device being
programmed. Then release adapter's ZIF socket.
- The cover must be fully actuated (depressed)
before inserting a device into the socket. If device
is inserted into only partially opened ZIF socket,
then - after releasing of cover - the tweezer
contacts might bend and if repeated several times
this way tweezer contacts might even break.
- Do not press on device while inserting it
and/or releasing the cover.
- Visually check the placement
of programmed device in adapter's ZIF socket. If
everything looks OK, the device is ready for
programming.
- To take out the device from adapter, push the
cover of adapter's ZIF socket and remove the device.
- When you finish the work with adapter, remove it
from programmer's ZIF socket.
- Operation conditions: operating temperature 5°C ÷
40°C (41°F ÷ 104°F), operating humidity 20%...80%,
non condensing.
- For handling with the device we
recommended to use a
vacuum pick up
tool.
Accepted package(s)
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BGA
package
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
- |
- |
1.2 |
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Ball Height
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A1 |
0.25 |
0.3 |
0.35 |
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Body Thickness
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A2 |
0.65 |
- |
- |
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Ball Diameter
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b |
0.35 |
0.4 |
0.45 |
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Body Size
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D |
7.9 |
8 |
8.1 |
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Body Size
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E |
5.9 |
6 |
6.1 |
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Ball Pitch
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e |
- |
1 |
- |
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Ball Array D
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GD |
- |
5 |
- |
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Ball Array E
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GE |
- |
5 |
- |
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The information in this document are subject to
change without notice.
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