|
special adapter assigned for
NAND flash devices in package BGA67 8x6.5mm, pitch 0.8mm
designed for TurboMode
used ZIF-CS socket accepts many variants of supported package, different in ball
diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 500.000 actuations
supported from PG4UW software version 3.04h
| Ord. no. |
70-3116 |
| Socket |
ZIF BGA67, ClamShell type |
| Bottom |
2 rows, 2x24 pins square, 0.6x0.6mm, row spacing 600mil |
| Class |
Specialized |
| Subclass |
other |
|
|
|
Adapter manual
- Protect the pins of adapter and adapter's ZIF
socket from contamination. Don't touch the pins with
bare hands. Any dirt and/or fat may cause errors
during programming.
- Usage of
vacuum pick up tool
is expected for device handling.
- Proceed with care! Incorrect insertion of
adapter in programmer's ZIF socket or device in
adapter's ZIF socket may lead to programmed device
damage.
- Insert converter to the device programmer ZIF
socket according to the picture placed near of it.
If you have some doubts about orientation of this
converter in device programmer ZIF socket, it is
valid general rule, the orientation of the text of
title is the same as the text on the top of the
device programmer.
- Visually check the placement
of adapter in programmer's ZIF socket.
- Release the pawl on
adapter's ZIF socket to open it. The socket cap will
open by spring force. Insert the device into
adapter's ZIF socket. For correct device
orientation, follow the instructions shown on
picture in PG4UW software Device info window for
device being programmed.
- Visually check the placement
of programmed device in adapter's ZIF socket. If it
looks OK, close adapter's ZIF socket cap by hand and
secure the pawl.
- To take out the device, open
converter ClamShell ZIF socket and remove device from it.
- When you finish work with
converter, remove it from the programmer ZIF socket.
- Operation conditions: operating temperature 5°C
-
40°C (41°F - 104°F), operating humidity 20%...80%,
non condensing.
- For handling with the device we
recommended to use a
vacuum pick up
tool.
Accepted package(s)
| BGA package |
 |
|
|
|
NAME
|
SYMBOL |
MIN |
NOM |
MAX |
|
Profile
|
A |
- |
- |
1 |
|
Ball Height
|
A1 |
0.22 |
0.26 |
0.3 |
|
Body Thickness
|
A2 |
- |
- |
- |
|
Ball Diameter
|
b |
0.41 |
0.46 |
0.51 |
|
Body Size
|
D |
- |
8 |
- |
|
Body Size
|
E |
- |
6.5 |
- |
|
Ball Pitch
|
e |
- |
0.8 |
- |
|
Ball Array D
|
GD |
- |
10 |
- |
|
Ball Array E
|
GE |
- |
8 |
- |
|
|
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The information in this document are subject to
change without notice.
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