BGA-Top-62 ZIF-CS
Order No.: 70-0484

top board of BGA adapters
used ZIF socket may accepts one or more variants of supported package, different in ball diameter, ball high and/or body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board
operation (mechanical) life of ZIF socket - 500.000 actuations

Order no.: 70-0484
Price:        € 630,00

Adapter manual

• Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
• Usage of vacuum pick up tool is expected for device handling.
• Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
• For work with BGA device it is necessary put together BGA-Top-62 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
• The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
• Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
• For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package

NAME SYMBOL MIN NOM MAX Profile A 0.86 - 1 Ball Height A1 0.2 - - Body Thickness A2 0.66 0.71 0.76 Ball Diameter b 0.25 0.3 0.35 Body Size D 9.85 9.95 10.05 Body Size E 10.85 10.95 11.05 Ball Pitch e - 0.5 - Ball Array D GD - 18 - Ball Array E GE - 12 -

NAME SYMBOL MIN NOM MAX Profile A - - 1.2 Ball Height A1 0.2 - - Body Thickness A2 0.85 - 0.97 Ball Diameter b 0.25 0.3 0.35 Body Size D - 10.95 - Body Size E - 9.95 - Ball Pitch e - 0.5 - Ball Array D GD - 18 - Ball Array E GE - 14 -

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The information in this document are subject to change without notice.