LGA-Top-195 ZIF-CS
Order No.: 70-1118

top board of LGA adapters
used ZIF socket may accepts one or more variants of supported package, different in ball diameter, ball high and/or body thickness. The picture at Accepted package(s) section shows the range of all dimensions of LGA packages, which are accepted by this LGA-Top board
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-1118
Socket ZIF LGA169, (depopulated array of (144) spring probes), Clamshell type
Bottom 8x25 + 3x20 pins square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top

 

Order no.: 70-1118
Price:        €

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with LGA device it is necessary put together LGA-Top-195 ZIF-CS with some LGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the LGA-Top-195 ZIF-CS and LGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

 SYMBOL MIN NOM MAX

Profile

 A - - 1.2

Ball Height

 A1 - - -

Body Thickness

 A2 - - -

Ball Diameter

 b 0.3 0.35 0.4

Body Size

 D - 9 -

Body Size

 E - 9 -

Ball Pitch

 e - 0.65 -

Ball Array D

 GD - 13 -

Ball Array E

 GE - 13 -
 

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The information in this document are subject to change without notice.