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BGA-Bottom-360
Order No.: 70-3447
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bottom board of BGA adapters, assigned for STMicroelectronics STM32
devices
supported from PG4UW software version 3.40d
| Ord. no. |
70-3447 |
| Socket |
8x25+3x20 socket forwire wrap
pins |
| Bottom |
2x24 pins square, 0.6x0.6mm, row spacing 600mil |
| Class |
BGA/LGA |
| Subclass |
BGA-Bottom |
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Order no.: 70-3447
Price: €
99,00
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Converter manual
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Protect the pins of adapter and adapter's ZIF
socket from contamination. Don't touch the pins with
bare hands. Any dirt and/or fat may cause errors
during programming.
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For work with BGA device it is necessary put
together BGA-Bottom-360 with some BGA-Top-x board according the information
provided by PG4UW software.
- Operation conditions: operating temperature 5°C
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40°C (41°F - 104°F), operating humidity 20%...80%,
non condensing.
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The information in this document are subject to
change without notice.
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