|
specialized programming module for M29DW128G60ZA and similar NOR Flash
devices in TBGA64 package
used ZIF socket may accept one or more variants of supported
package, different in ball diameter, ball high and/or body thickness, see
section Accepted package(s)
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.11l
| Ord. no. |
71-3351 |
| Socket |
ZIF BGA64, open top type |
| Bottom |
2 female connectors by 32 pins,
DIN41612 B/2 |
| Class |
Specialized |
| Subclass |
Memory (NOR/NAND/eMMC) |
|
|
|
Module manual
- Protect the contacts of module's connectors
and ZIF socket from contamination. Any dirt and/or
fat on contacts may cause errors during programming.
- Proceed with care! Incorrect insertion of
device in module's ZIF socket may lead to programmed
device damage.
- Unscrew 2 knurled thumb screws. Properly Insert
programming module into Programmer Module Interface
connectors, until it clicks. Due to connectors
shape, only one orientation and position of
programming module in Programmer Module Interface
connectors is possible. Screw 2 knurled thumb screws
to fix programming module to programmer.
- Push the cover of module's
ZIF socket (the topmost movable part) to open the
socket. Insert the device into module's ZIF socket.
Correct position of programmed device in module's
ZIF socket is indicated by picture near (usually on
left above) the module's ZIF socket. On that
picture, reference corner of device (e.g. position
of pin 1) is indicated by dot, by number 1, by
bevelled corner or by any combination of mentioned.
Then release module's ZIF socket.
- The cover must be fully actuated (depressed)
before inserting a device into the socket.
- Do not press on
device while inserting it and/or releasing the
cover.
- Visually check the placement of programmed
device in module's ZIF socket. If everything looks
OK, the device is ready for programming.
- To take out the device from
module, push the cover of module's ZIF socket and
remove the device.
- When you finish the work
with module, unscrew 2 knurled thumb screws and
remove the module from Programmer Module Interface
connectors.
- For handling with the device we recommended to use a
vacuum pick up
tool.
- Operating
conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F),
humidity 20% ÷ 80% non-condensing.
Accepted package(s)
|
BGA
package
|
 |
|
 |
|
|
NAME
|
SYMBOL |
MIN |
NOM |
MAX |
|
Profile
|
A |
- |
- |
1.2 |
|
Ball Height
|
A1 |
0.2 |
0.3 |
0.35 |
|
Body Thickness
|
A2 |
- |
0.8 |
- |
|
Ball Diameter
|
b |
0.35 |
- |
0.5 |
|
Body Size
|
D |
12.9 |
13 |
13.1 |
|
Body Size
|
E |
9.9 |
10 |
10.1 |
|
Ball Pitch
|
e |
- |
1 |
- |
|
Ball Array D
|
GD |
- |
8 |
- |
|
Ball Array E
|
GE |
- |
8 |
- |
|
|
|
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The information in this document are subject to
change without notice.
|
