 |
|
Click on
Data Sheet / PDF
for further
information about:
-Part Number
Details
-Outline Socket Dim. -Outline IC Dim.
-PCB Layouts
.
|
See Table
Below
. | |
| Series:
NP352 - Open Top (ZIF) |
| Title: Fine
Ball Grid Array (FBGA) |
| |
|
| Features |
|
|
|
|
|
- Open top type sockets for FBGA packages
|
- Self contacting structure without upper
pressingforce (ZIF)
|
- Contacting structure to nip the sides of solder
balls to lower damages of coplanarity of solder
balls
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 100V DC |
| Dielec. Withstd. Voltage: |
100V AC for 1 minute |
| Contact Resistance: |
100m max. at 10mA/20mV
max. |
| Operating Temp. Range: |
–40°C to +150°C
–55°C to
+150°C |
| Contact force: |
15g per pin approx. |
| Mating Cycles: |
10,000 insertions min. |
| |
|
| Materials and Finish |
|
| Housing: |
Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES),
glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over Nickel | | |
