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Full Data Sheet

PDF file size: 84KB
 
Series: NP291 - Open Top
Title: Fine Ball Grid Array (FBGA)
 
Features
  • Pin counts 36, 40, 44, 48, 54, 56, 72, 168 and 288
  • Pitch size 0.75mm
  • Open top type sockets for FBGA packages
  • Self contacting structure without upper pressing force package
  • Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
 
Specifications
Insulation Resistance: 1,000M min. at 100V DC
Dielec. Withstd. Voltage: 100V AC for 1 minute
Contact Resistance: 100m max. at 10mA/20mV max.
Operating Temp. Range: –55°C to +170°C
Contact force: 15g per pin approx.
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
 
 
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