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PDF file size: 62KB
 
Series: IC398 - Open Top
Title: Chip Scale Package 0.50mm Pitch
 
Features
  • Open top socket for BGA / LGA / CSP packages with 0.50mm pitch 18 x 18 maximum grid size
  • SMT soldering (0.50mm pitch)
  • Open top type sockets for FBGA packages
  • Depopulation versions available
 
Specifications
Insulation Resistance: 1,000M min. at 100V DC
Dielec. Withstd. Voltage: 100V AC for 1 minute
Contact Resistance: 100m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C
Contact force: 6gf per pin approx.
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
 
 
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