Click on Overview for further information about:
-Part Number Details

-Socket Dimensions
Overview
(PDF file size: 44KB)

Selection of:
-PCB Layouts

-Matching IC Dim.

225, 256, 342 pins
PDF file size: 79KB
:
576 & 696 pins
PDF file size: 51KB
:
729 pins
PDF file size: 130KB
:
 
Series: IC280 - Clamshell
Title: Fine Ball Grid Array (FBGA)
 
Features
  • Pin counts 169, 196, 209, 225, 256, 257, 324, 340, 484,576,  671, 696, 720, 729, 740 and 868
  • Pitch sizes 0.75,  0.8 and 1.0mm
  • Clamshell socket for FBGA packages
  • V-shape contact structure to lower the damage of coplanarity of solder balls
 
Specifications
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 700V AC for 1 minute
for 1.0mm pitch

500V AC for 1 minute

for 0.8mm pitch

100V AC for 1 minute

for 0.75mm pitch
Contact Resistance: 30m max. at 10mA/20mV max.
Operating Temp. Range: –40°C to +150°C
Contact force: 15g~35g within contact travel distance between 0.2~0.5mm
Mating Cycles: 10,000 insertions
Materials and Finish
Housing: Polyethersulphone (PES), glass-filled and Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
 
 
 
Auswahl Info anfordern Home