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DIL8/BGA12-2 ZIF-CS SFlash-1
Order No.: 70-3455
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specialized adapter for Serial Flash devices in WLCSP12 package
4.49x2.80mm, pitch 0.5mm. Designed for TurboMode
Used ZIF socket accepts many variations of BGA
packages, that differ in ball diameter, ball height and body thickness The
picture at Accepted package(s) section shows the range of all dimensions of
BGA packages, which are accepted by this BGA adapter
operation (mechanical) life of ZIF socket - 500.000 actuations
supported from PG4UW software version 3.16w
| Ord. no. |
70-3455 |
| Socket |
ZIF BGA12, ClamShell type |
| Bottom |
2 rows, 2x24 pins square, 0.6x0.6mm |
| Class |
Specialized |
| Subclass |
EPROM/Flash |
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Move the cursor over the picture for additional view
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Order no.: 70-3455
Price: €
680,00
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Adapter manual
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Insert adapter to the device programmer ZIF socket according to the picture placed near of it. If you have
some doubts about orientation of this adapter in device programmer ZIF socket, it is valid general rule, the
orientation of the text of title is the same as the text on the top of the device programmer.
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Open the adapter ClamShell ZIF socket. Insert the device inside (place device on contacts). The right position of
the programmed device in adapter BGA ZIF socket is shown on body of adapter. The reference corner (position of pin A1)
of the device is indicated by dot.
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Visually check interconnection between device and adapter ClamShell ZIF socket. If everything looks OK, close it and now,
device is ready for programming.
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Be careful, because the incorrect insertion of
adapter to the device programmer ZIF socket or
device to the adapter ClamShell ZIF socket can
damage the programmed device.
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To take out the device, open adapter ClamShell ZIF
socket and remove device from it.
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When you finish work with adapter, remove it from
the device programmer ZIF socket.
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Do not directly touch the pins of the adapter and
adapter ZIF socket, because dirt may cause errors
during programming of device.
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Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
- For handling with the device we recommended to use a
vacuum pick up
tool.
Accepted package(s)
| BGA package |
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NAME
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SYMBOL |
MIN |
NOM |
MAX |
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Profile
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A |
0.42 |
0.47 |
0.52 |
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Ball Height
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A1 |
0.152 |
0.167 |
0.182 |
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Body Thickness
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A2 |
- |
- |
- |
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Ball Diameter
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b |
0.24 |
0.3 |
0.36 |
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Body Size
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D |
4.47 |
4.49 |
4.51 |
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Body Size
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E |
2.78 |
2.8 |
2.82 |
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Ball Pitch
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e |
- |
0.5 |
- |
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Ball Array D
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GD |
- |
6 |
- |
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Ball Array E
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GE |
- |
4 |
- |
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The information in this document are subject to
change without notice.
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