Order No.: 70-4154

special adapter assigned for TI (TMS) BQ27520-G4 devices in DBGA15 package, matrix 5x3
used ZIF-CS socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 500.000 actuations
supported from PG4UW software version 3.29

Ord. no. 70-4154
Socket ZIF BGA15, ClamShell type
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Class Specialized
Subclass TI (TMS) MCU

Move the cursor over the picture for additional view

Order no.: 70-4154
Price:        €

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • Insert converter to the device programmer ZIF socket according to the picture placed near of it. If you have some doubts about orientation of this converter in device programmer ZIF socket, it is valid general rule, the orientation of the text of title is the same as the text on the top of the device programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Release the pawl on adapter's ZIF socket to open it. The socket cap will open by spring force. Insert the device into adapter's ZIF socket. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed.
  • Visually check the placement of programmed device in adapter's ZIF socket. If it looks OK, close adapter's ZIF socket cap by hand and secure the pawl.
  • To take out the device, open converter ClamShell ZIF socket and remove device from it.
  • When you finish work with converter, remove it from the programmer ZIF socket.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  





A - - 0625

Ball Height

A1 0.15 - 0.35

Body Thickness

A2 - - -

Ball Diameter

b 0.25 - 0.35

Body Size

D 2.56 2.61 2.66

Body Size

E 1.906 1.956 2.006

Ball Pitch

e - 0.5 -

Ball Array D

GD - 5 -

Ball Array E

GE - 3 -

Back to top

The information in this document are subject to change without notice.