DIL48/BGA152-1 ZIF NAND-1
Order No.: 70-3492

specialized adapter for NAND flash devices in package BGA152 18x14mm, pitch 1.0mm
designed for TurboMode
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s) board
operation (mechanical) life of ZIF socket - 10.000 actuations
supported from PG4UW software version 3.38p
 
Ord. no. 70-3492
Socket ZIF BGA152, open top type
Bottom 2 rows, 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass EPROM/Flash

Order no.: 70-3492
Price:        € 725,00

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • Insert adapter into programmer's ZIF socket. If you are in doubts about orientation of the adapter in programmer's ZIF socket, there is a rule of thumb - orientation of adapter's name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Push the cover of adapter's ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.
  •  

Accepted package(s)

BGA package

NAME

SYMBOL MIN NOM MAX

Profile

A 1.15 1.3 1.4

Ball Height

A1 0.25 - -

Body Thickness

A2 - - -

Ball Diameter

b - 0.55 -

Body Size

D 17.9 18 18.1

Body Size

E 13.9 14 14.1

Ball Pitch

e - 1 -

Ball Array D

GD - 17 -

Ball Array E

GE - 13 -
 

  Back to top

The information in this document are subject to change without notice.