Order No.: 70-0367

top board of BGA adapters
used ZIF socket may accepts one or more variants of supported package, different in ball diameter, ball high and/or body thickness. The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-0367
Socket ZIF BGA150, (depopulated array of (19) spring probes) ClamShell type
Bottom 4 rows, 4x25 pins square, 0.6x0.6mm
Subclass BGA-Top


Order no.: 70-0367
Price:        € 430,00

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-32 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  





A 1.2 1.3 1.4

Ball Height

A1 0.27 0.32 0.37

Body Thickness

A2 - - -

Ball Diameter

b 0.4 0.45 0.5

Body Size

D 12.9 13 13.1

Body Size

E 10.4 10.5 10.6

Ball Pitch

e - 0.8 -

Ball Array D

GD - 15 -

Ball Array E

GE - 10 -

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The information in this document are subject to change without notice.