BGA-Top-106 ZIF-CS
Order No.: 70-0642

top board of BGA adapters
used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
operation (mechanical) life of ZIF socket - 500.000 actuations

Ord. no. 70-0642
Socket ZIF BGA121, ClamShell type
Bottom 8+3 rows, 8x25 + 3x20 pins square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top

Move the cursor over the picture for additional view

Order no.: 70-0642
Price:        € 723,00

Adapter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • Usage of vacuum pick up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-106 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%...80%, non condensing.
  • For handling with the device we recommended to use a vacuum pick up tool.

Accepted package(s)

BGA package  

 

NAME

SYMBOL MIN NOM MAX

Profile

A - - 1.2

Ball Height

A1 0.15 - -

Body Thickness

A2 - - 1

Ball Diameter

b 0.25 0.3 0.35

Body Size

D - 6 -

Body Size

E - 6 -

Ball Pitch

e   0.5  

Ball Array D

GD - 11 -

Ball Array E

GE - 11 -
 

  Back to top

The information in this document are subject to change without notice.