Order No.: 70-3415

bottom board of BGA adapters, assigned for Actel/Microsemi SmartFusion devices in matrix 22x22
supported from PG4UW software version 3.14l

Ord. no. 70-3415
Connection to BGA-Top-X 8x50 + 2x50 sockets for B-T-B connector, pitch 0.8mm
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Subclass BGA-Bottom

Order no.: 70-3415
Price:        €

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • For work with BGA device it is necessary put together BGA-Bottom-268 with some BGA-Top-x board according the information provided by PG4UW software.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.

  Back to top

The information in this document are subject to change without notice.