Order No.: 70-1009

bottom board of BGA adapters, assigned for eMMC devices in matrix 14x14-8x8+6x6-4x4 for example H26M11002AAR, THGBM1G5D2EBAI7, KMAFN0000M-S998000, SDIN5D2-2G

Ord. no. 70-1009
Connection to BGA-Top-X 4x25 sockets for wire wrap pin
Bottom 2 rows, 2x24 pins square, 0.6x0.6mm,  row spacing 600mil
Subclass BGA-Bottom

Order no.: 70-1009
Price:        € 85,00

Converter manual

  • Protect the pins of adapter and adapter's ZIF socket from contamination. Don't touch the pins with bare hands. Any dirt and/or fat may cause errors during programming.
  • For work with BGA device it is necessary put together BGA-Bottom-165 with some BGA-Top-x board according the information provided by PG4UW software.
  • Operation conditions: operating temperature 5°C - 40°C (41°F - 104°F), operating humidity 20%...80%, non condensing.

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The information in this document are subject to change without notice.